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Locations include USA, Europe and Asia
PCB Quick Turn capabilities:  PCB up to 12 layer in 24 hours, up to 36 layer in 72 hours, Flex 1 & 2 Layer in 24 hours, Rigid Flex in 48 hours
PCB Standard Capabilities: 48+ Layers, Impedance Control +/- 2.5%, SMT Pitch .010, Laser HDI Finished .003, Buried & Blind Via, .003 / .003 Line Width & Spacing, Minimum Drilled Hole .0098, Aspect Ration 15 to 1, Finished Thickness +/- 7%
Material Types: FR4 Tg 140, GETEK, Polyimide, RoHS Materials, FR4 Tg 170, Rogers, Duroid, Exotic Materials
Flex & Rigid-Flex Standard capabilities: Up to 30 layers Flex, Staggered Layer Flex, Blind and Buried Via, Book Binder

  • Cable and harnesses
  • Sub-Assemblies
  • Top level assemblies

PCB and PCBA 

  • Process Developement
  • Manufacturing process instruction development
  • Manufacturing tooling design
  • Flexible and responsive production lines
  • Prototype, pre-production and production
  • Quality Assurance plan development and implementation
  • Turn-key material planning, procurement and kitting
  • Box-build and custom pack-out
  • Wire harness design production and assembly

Cable and Harness

Low Volume, Quick Turn to High Volume Fabrication and Assembly

Assembly and Test